Article 10316

Title of the article

LOCALIZING THE BLINKING FAULTS OF ‘SHORT CIRCUIT’ TYPE UNDER
VIBRATION IMPACT ON INTEGRATED CIRCUITS IN BGA CASE

Authors

Grechishnikov Vladimir Mikhaylovich, doctor of technical sciences, professor, head of sub-department of electrical engineering, Samara National Research University named after academic S. P. Korolev (443086, 34 Moscow highway, Samara, Russia), gv@ssau.ru
But'ko Aleksey Dmitrievich, engineer, postgraduate student, sub-department of electrical engineering, Samara National Research University named after academic S. P. Korolev (443086, 34 Moscow highway, Samara, Russia), LexAK47@ya.ru
Erilkin Aleksey Andreevich, student, Samara National Research University named after academic S. P. Korolev (443086, 34 Moscow highway, Samara, Russia), LexAK47@ya.ru

Index UDK

681.518.5

DOI

10.21685/2307-4205-2016-3-10

Abstract

Background. The difficult electronic modules used onboard the aviation and space-rocket industry are exposed to different environmental activities such as: vibration effects, thermal shocks, sharp differential pressures, humidity and to that similar. Owing to such influences often there are not stable defects in time like "short circuit" and "open pin". Which search and localization is in vitro impossible because time of existence of defect is connected to a deviation from reference conditions of operation.
Matherials and methods. The perspective direction in research of such processes in electronic modules is use of a method of the boundary scanning based on the IEEE 1149.1 standard allowing with the help programmatically – hardware, to check integrity of electrical communications on the printed circuit board, for read seconds. It is possible to apply the developed test applications for search and localization of defects together with accelerated tests of HALT/HASS. This technique allows in real time, in case of different environmental activities on electronic modules, to within a leg of a chip or under "ball" of theBGA casing to localize defect.
Results. The offered technique of simulation allowed to determine frequencies at which are shown defect like "short circuit". Efficiency of search of "flickering defects" depending on frequency vibration impacts on chips in the BGA casing is also calculated.
Conclusions. Vibrational influences have significant effect on operation of any electronic equipment. The study of dependence of appearance of defects not only from vibrations, but also from any other environmental activities is actual. It will allow to solve an equipment failure problem onboard aviation and is rocket – the space industry.

Key words

vibration, defect, JTAG interface, security, ProVision, efficiency.

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Дата создания: 28.09.2016 15:20
Дата обновления: 29.09.2016 15:36